LNP™ THERMOCOMP™ Compound 5C003 by SABIC is a compound based on electrically conductive, polyvinylidene fluoride (PVDF) that is filled with 15% carbon fiber. It shows high stiffness & strength. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound 5C003 is recommended for electrical applications, energy management, electronic components and industrial material handling.
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LNP™ THERMOCOMP™ Compound 5C003 properties
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Stress | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Dart Drop | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Unnotched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Transverse | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Moisture Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear, Transverse to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Deflection Temperature at 0.45 MPa (66 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Deflection Temperature at 1.8 MPa (264 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Heat Deflection Temperature (HDT), Unannealed | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Heat Deflection Temperature (HDT), Unannealed | 0.0 Visible After Login | Visible After Login | Visible After Login |
LNP™ THERMOCOMP™ Compound 5C003 Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Back Pressure | Visible After Login | Visible After Login | |
| Drying Temperature | Visible After Login | Visible After Login | |
| Drying Time | Visible After Login | Visible After Login | |
| Front Zone 3 Temperature | Visible After Login | Visible After Login | |
| Melt Temperature | Visible After Login | Visible After Login | |
| Middle Zone 2 Temperature | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |
| Rear Zone 1 Temperature | Visible After Login | Visible After Login | |
| Screw Speed | Visible After Login | Visible After Login | |