TC3-i3-0524-PA-FL by PlastFormance is an electrically isolating, highly thermally conductive polyamide (PA). It is suitable for processing by injection molding even at very high filler contents (80% vol.).
- It is suitable for heatsink, overmolding of electronics, enclosures for electronic potting, and heat dissipation of plugs and power electronics.
- TC3-i3-0524-PA-FL is used in heatspreader, sensor overmolding, functional enclosures and as substitution of die casted aluminum.
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TC3-i3-0524-PA-FL properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Electrical Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Thermal Conductivity | 0.0 Visible After Login | Visible After Login | Visible After Login |