AURUM® PL450C by Mitsui Chemicals is a high heat resistant polyimide (PI) grade. Possesses good transparency, toughness and good dimensional stability. Provides excellent cleanness, low outgassing and low level impurities. Exhibits heat shock and plasma resistance. Is suitable for processing by injection molding. AURUM® PL450C is used in film, tube, manufacturing equipment for semiconductor and cable coating.
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AURUM™ PL450C properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Dielectric Constant | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dielectric Constant | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dissipation Factor | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dissipation Factor | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Surface Resistance | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Flammability properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flame Rating, UL 94 | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Limiting Oxygen Index (LOI) | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Hardness, Rockwell M | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Hardness, Rockwell R | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Elongation | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Linear Mold Shrinkage, Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Transverse | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Gravity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Water Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear, Transverse to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Heat Deflection Temperature (HDT) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Heat Capacity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Thermal Conductivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
AURUM™ PL450C Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Cylinder Nozzle Temperature | Visible After Login | Visible After Login | |
| Drying Temperature | Visible After Login | Visible After Login | |
| Drying Time | Visible After Login | Visible After Login | |
| Hopper Temperature | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |