Category overview

Polyimide (PI)

Based on 98 products - Last update on the Sep 22, 2025

Polyimide (PI) is a high-performance polymer that appears as a smooth, glossy material, often amber or yellow in color. Its chemistry involves imide monomers, providing exceptional thermal stability, mechanical toughness, and chemical resistance. Key features include the ability to withstand temperatures above 500°C, excellent dielectric properties, and high mechanical strength. Main applications of polyimide are in electronics, aerospace, and automotive industries. 

Alternatives to polyimide include PEEK and PTFE. A trend in this technology is the increasing use of polyimide in flexible electronics and high-temperature fuel cells due to its superior thermal and electrical properties. Sub-types of polyimide include thermosetting and thermoplastic versions, each offering unique advantages for specific applications.

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Linear Mold Shrinkage, Flow (31)
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Ultramid® H33 L

by BASF

Ultramid® H33 L by BASF is a thermoplastic polyamide (PI) with a high water permeability. It has high strength and hydrophilic properties that allows subsequent drying directly in the casing. Ultramid® H33 L is used in artificial casings in which sausages can be smoked and then dried.
  • Recently launched

EXTEM™ RESIN RH1017UCL

by SABIC

EXTEM™ RESIN RH1017UCL by SABIC is a non halogenated flame retardant thermoplastic polyimide (TPI) resin. It is free from PFAS, chlorine and bromide. It shows high glass transition temperature, chemical-, creep- and high temperature resistance. It provides good processability, high flow, stiffness and strength. It possesses lead free reflow soldering capability and dielectrics.<br> <ul style="padding-left: 40px;"><li>It exhibits low ionic/outgassing/liquid particle count, moisture absorption, shrinkage, smoke, toxicity and warpage. <li>It offers excellent mechanical, electrical and dimensional properties at high temperatures, including high refractive index similar to standard Ultem™.</li> <li>It is suitable for processing by injection molding.</li> <li>It is used in the manufacturing of complex optical lens assemblies while maintaining dimensional stability during 260°C peak temperature through JEDEC-compliant solder reflow assembly process.</li> <li>EXTEM™ RESIN RH1017UCL is recommended for industrial applications including automotives, electronic and electronics for energy management, electronic components, mobile phone, computer, tablets, lighting and wireless communication.</li> <li>It complies with RoHS.</li></ul>
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BASF

693 Products

Polyimide (PI)