Technical datasheet

LEMALLOY® C82HL

Supplied byMitsubishi Engineering-Plastics- Last Updated on Dec 21, 2018

Lemalloy® C82HL is a polyphenylene ether and polyamide 66 (PPE+PA66) grade. Exhibits high rigidity, high impact strength and good dimensional stability, good fatigue resistance and good insulation properties. Possesses low dielectric constant, low dissipation factor, low water absorption, low shrinkage rate and low specific gravity. Shows excellent self-extinguishing and easy flow properties. Provides good moldability, good processability, good mold release and heat stability. Suitable for processing by injection molding.
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LEMALLOY® C82HL properties

Electrical properties

PropertiesValue & unitTest conditionTest method
Dielectric Strength0.0 Visible After LoginVisible After LoginVisible After Login
Dielectric Strength0.0 Visible After LoginVisible After LoginVisible After Login
Dissipation Factor0.0 Visible After LoginVisible After LoginVisible After Login
Dissipation Factor0.0 Visible After LoginVisible After LoginVisible After Login
Surface Resistivity0.0 Visible After LoginVisible After LoginVisible After Login
Volume Resistivity0.0 Visible After LoginVisible After LoginVisible After Login

Mechanical properties

PropertiesValue & unitTest conditionTest method
Flexural Modulus0.0 Visible After LoginVisible After LoginVisible After Login
Flexural Strength0.0 Visible After LoginVisible After LoginVisible After Login
Impact Strength, Charpy0.0 Visible After LoginVisible After LoginVisible After Login
Impact Strength, Notched Charpy0.0 Visible After LoginVisible After LoginVisible After Login
Modulus of Elasticity0.0 Visible After LoginVisible After LoginVisible After Login
Nominal Tensile Strain at Break0.0 Visible After LoginVisible After LoginVisible After Login
Tensile Strain0.0 Visible After LoginVisible After LoginVisible After Login

Other properties

PropertiesValue & unitTest conditionTest method
Dielectric Constant0.0 Visible After LoginVisible After LoginVisible After Login
Dielectric Constant0.0 Visible After LoginVisible After LoginVisible After Login
Tensile Strength at Yield0.0 Visible After LoginVisible After LoginVisible After Login

Physical properties

PropertiesValue & unitTest conditionTest method
Density0.0 Visible After LoginVisible After LoginVisible After Login
Linear Mold Shrinkage, Flow0.0 Visible After LoginVisible After LoginVisible After Login
Linear Mold Shrinkage, Transverse0.0 Visible After LoginVisible After LoginVisible After Login
Melt Volume Flow Rate (MVR)0.0 Visible After LoginVisible After LoginVisible After Login

Thermal properties

PropertiesValue & unitTest conditionTest method
Decomposition Temperature0.0 Visible After LoginVisible After LoginVisible After Login
Heat Deflection Temperature (HDT), Unannealed0.0 Visible After LoginVisible After LoginVisible After Login
Heat Deflection Temperature (HDT), Unannealed0.0 Visible After LoginVisible After LoginVisible After Login

LEMALLOY® C82HL Processing Guidelines

Injection Molding Processing Guidelines

PropertiesValue & unitTest conditionTest method
Drying TemperatureVisible After LoginVisible After Login
Drying TimeVisible After LoginVisible After Login
Front TemperatureVisible After LoginVisible After Login
Injection PressureVisible After LoginVisible After Login
Injection SpeedVisible After LoginVisible After Login
Middle TemperatureVisible After LoginVisible After Login
Mold TemperatureVisible After LoginVisible After Login
Nozzle TemperatureVisible After LoginVisible After Login
Rear TemperatureVisible After LoginVisible After Login
Screw SpeedVisible After LoginVisible After Login

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