Technical datasheet
LEMALLOY® BX504D
Supplied byMitsubishi Engineering-Plastics- Last Updated on Dec 21, 2018
Lemalloy® BX504D is a polyphenylene ether and polyamide 6 (PPE+PA6) grade. Exhibits high rigidity, high impact strength and good dimensional stability, good fatigue resistance and good insulation properties. Possesses low dielectric constant, low dissipation factor, low water absorption, low shrinkage rate and low specific gravity. Shows excellent self-extinguishing and easy flow properties. Provides good moldability, good processability, good mold release and heat stability. Suitable for processing by injection molding. Recommended for manufacture of car automobile parts like bumper, rear spoilers, back door, fender, bumper under spoilers, hood bulge, aero parts and hatchback panel.
Product family:
Chemical family:
Product Type:
| Bio Based content | Visible After Login |
| Appearance | Visible After Login |
Compliance
| Certifications & Compliance | Visible After Login |
Applications
Recommended markets
Applications
Conversion mode
Availability
Product Status:Visible After Login
LEMALLOY® BX504D properties
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Transverse | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melt Volume Flow Rate (MVR) | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Decomposition Temperature | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Heat Deflection Temperature (HDT), Unannealed | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Heat Deflection Temperature (HDT), Unannealed | 0.0 Visible After Login | Visible After Login | Visible After Login |
LEMALLOY® BX504D Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Drying Temperature | Visible After Login | Visible After Login | |
| Drying Time | Visible After Login | Visible After Login | |
| Front Temperature | Visible After Login | Visible After Login | |
| Injection Pressure | Visible After Login | Visible After Login | |
| Injection Speed | Visible After Login | Visible After Login | |
| Middle Temperature | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |
| Nozzle Temperature | Visible After Login | Visible After Login | |
| Rear Temperature | Visible After Login | Visible After Login | |
| Screw Speed | Visible After Login | Visible After Login | |