EP3UF is a one-component epoxy (EP) system by Master Bond. It is a 100% reactive and does not contain any solvents or diluents. It has low viscosity and cures easily at elevated temperature. Offers good thermal conductivity, electrical insulation good flow and processability. Exhibits good mechanical strength, dimensional stability and low shrinkage. It resists many chemicals, such as oils and fuels. Suitable for bonding and underfill applications in microelectronic packaging and assembly. The shelf life of EP3UF is 6 months. Meets RoHS and NASA Low Outgassing specifications.
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EP3UF properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Dielectric Constant | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dielectric Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Compressive Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Hardness, Shore D | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Solid Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Viscosity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Service Temperature | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Thermal Conductivity | 0.0 Visible After Login | Visible After Login | Visible After Login |