Technical datasheet

EP17HTND-CCM

Supplied byMaster Bond- Last Updated on Jan 16, 2026

EP17HTND-CCM by Master Bond is an electrically insulating, heat cured, one-component epoxy (EP) system. Resists many chemicals, such as acids, bases, fuels, salt and oils. Offers low shrinkage, thermal conductivity and high flow benefits. Also exhibits high solvent- and temperature resistance. Used for glob top and electronic applications. EP17HTND-CCM by Master Bond meets RoHS and NASA Low Outgassing regulation. It has a shelf life of 3-6 months.
Product Type:
Bio Based contentVisible After Login
ColorVisible After Login
AppearanceVisible After Login

Benefits

Visible After Login|

Visible After Login|

Visible After Login

Compliance

Certifications & Compliance
Visible After Login

Applications

Recommended markets

Availability

Product Status:Visible After Login

EP17HTND-CCM properties

Electrical properties

PropertiesValue & unitTest conditionTest method
Dielectric Constant0.0 Visible After LoginVisible After LoginVisible After Login
Dissipation Factor0.0 Visible After LoginVisible After LoginVisible After Login
Volume Resistivity0.0 Visible After LoginVisible After LoginVisible After Login

Mechanical properties

PropertiesValue & unitTest conditionTest method
Compressive Strength0.0 Visible After LoginVisible After LoginVisible After Login
Hardness, Shore D0.0 Visible After LoginVisible After LoginVisible After Login
Lap Shear Strength0.0 Visible After LoginVisible After LoginVisible After Login
Modulus of Elasticity0.0 Visible After LoginVisible After LoginVisible After Login
Tensile Strength0.0 Visible After LoginVisible After LoginVisible After Login

Other properties

PropertiesValue & unitTest conditionTest method
Solid Content0.0 Visible After LoginVisible After LoginVisible After Login

Thermal properties

PropertiesValue & unitTest conditionTest method
CTE, Linear0.0 Visible After LoginVisible After LoginVisible After Login
Glass Transition Temperature (Tg)0.0 Visible After LoginVisible After LoginVisible After Login
Service Temperature0.0 Visible After LoginVisible After LoginVisible After Login
Thermal Conductivity0.0 Visible After LoginVisible After LoginVisible After Login