Technical datasheet
SKYBOND® 8500
Supplied byIndustrial Summit Technology- Last Updated on Jan 9, 2024
SKYBOND® 8500 by Industrial Summit Technology is a polyimide (PI) grade by Industrial Summit Technology. Exhibits excellent thermal stability. SKYBOND® 8500 is suitable for processing by resin transfer molding (RTM). Used in aerospace and aircrafts.
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SKYBOND® 8500 properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Solid Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Viscosity, Melt | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Glass Transition Temperature (Tg) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Maximum Service Temperature, Air | 0.0 Visible After Login | Visible After Login | Visible After Login |