ForTii® LDS51B by Envalior is a halogen- & red phosphorus-free, truly reflow compatible and flame retarded, PPA (PA 4T) grade. It is reinforced with 30% glass fiber. It is suitable for processing by injection molding. It exhibits good chemical resistance, superior plating performance and is compatible with a broad range of laser settings enabling high resolution and fine-line capability. ForTii® LDS51B is applicable for laser direct structuring.
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Documents related to ForTii® LDS51B
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ForTii® LDS51B properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Comparative Tracking Index (CTI) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dissipation Factor | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dissipation Factor | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Surface Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Weldline Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Weldline Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Weldline Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Dielectric Constant | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dielectric Constant | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Moisture Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Water Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Deflection Temperature at 0.46 MPa (66 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Deflection Temperature at 1.8 MPa (264 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Glass Transition Temperature (Tg) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
ForTii® LDS51B Processing Guidelines
Injection Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Barrel Mold Temperature | Visible After Login | Visible After Login | |
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Back Pressure | Visible After Login | Visible After Login | |
| Barrel Center Temperature | Visible After Login | Visible After Login | |
| Barrel Front Temperature | Visible After Login | Visible After Login | |
| Barrel Melt Temperature | Visible After Login | Visible After Login | |
| Barrel Nozzle Temperature | Visible After Login | Visible After Login | |
| Barrel Rear Temperature | Visible After Login | Visible After Login | |
| Dew Point | Visible After Login | Visible After Login | |
| Drying Temperature | Visible After Login | Visible After Login | |
| Drying Time | Visible After Login | Visible After Login | |
| Melt Residence Time (MRT) | Visible After Login | Visible After Login | |
| Moisture Content | Visible After Login | Visible After Login | |
| Screw Rotation Speed | Visible After Login | Visible After Login | |
| Volumetric Compression Ratio | Visible After Login | Visible After Login | |