Domamid® H33 F by DOMO Chemicals is a natural high-quality polyamide 6 (PA) with reduced carbon footprint. It is hygroscopic and absorbs moisture when exposed to environments with high humidity. It is lightweight and offers excellent mechanical strength and outstanding chemical resistance.
- It contains no color pigments or other additives.
- It features easy processability along with resistance to abrasion and color fading.
- It possesses elongation suitable for spinning applications, provides puncture resistance, and supports elongation for extrusion applications.
- It is sustainable and recyclable and replaces metal in the automotive sector, contributing to vehicle weight reduction, energy savings, and streamlined production through the use of high-flow materials.
- It is suitable for processing by injection molding and film extrusion applications.
- Domamid® H33 F is ISCC PLUS compliant.
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| Bio Based | Visible After Login |
| Bio Based content | Visible After Login |
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Domamid® H33 F properties
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| 2% Secant Modulus, MD | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Coefficient of Friction (COF), Dynamic | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Coefficient of Friction (COF), Static | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Elongation at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Puncture Resistance, Force | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength, MD | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength, TD | 0.0 Visible After Login | Visible After Login | Visible After Login |
Optical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Haze | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Transparency | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density, Bulk | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Elongation at Break, MD | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Elongation at Break, TD | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Oxygen Transmission Rate (OTR) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Oxygen Transmission Rate (OTR) | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Water Permeability | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Weight of 100 Chips | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |