Domamid® H24 SSD01 by DOMO Chemicals is a low viscous, high-quality polyamide 6 (PA) with a reduced carbon footprint. It contains TiO2 and is lightweight, inherently stabilized against the harmful effects of UV radiation and heat. It is hygroscopic and will absorb moisture when exposed to high moisture content areas.
- It offers superior mechanical strength, excellent chemical resistance, ease of processing, abrasion and color resistance.
- It provides sustainability and recyclability.
- It replaces metals in the automotive industry, reducing car weight, saving energy and simplifying the production process by using high-flow materials.
- It is particularly suitable for the production of delustered textile mono- and multifilaments using conventional melt spinning processes at high process speed as well and guarantees excellent further processing properties.
- Domamid® H24 SSD01 is ISCC PLUS compliant.
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Domamid® H24 SSD01 properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density, Bulk | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Amino End Groups | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Extractable Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Titanium Dioxide Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Weight of 100 Chips | 0.0 Visible After Login | Visible After Login | Visible After Login |
Processing properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Moisture Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |


