CoolPoly® D5110 by Celanese is a thermally conductive polyphenylene sulfide (PPS) grade. Is an electrically insulative, lightweight and netshape moldable grade. CoolPoly® D5110 can be used for its dielectric properties. Designed for injection molding method. Complies with UL 94 V-0 Flame Rating.
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CoolPoly® D5110 properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Surface Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Flammability properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flame rating (UL 94) | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Unnotched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Linear Mold Shrinkage | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Gravity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Heat Deflection Temperature (HDT) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Heat Deflection Temperature (HDT) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Heat Capacity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Thermal Conductivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Thermal Diffusivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
CoolPoly® D5110 Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Back Pressure | Visible After Login | Visible After Login | |
| Center Zone Temperature | Visible After Login | Visible After Login | |
| Cushion | Visible After Login | Visible After Login | |
| Dew Point | Visible After Login | Visible After Login | |
| Drying Temperature | Visible After Login | Visible After Login | |
| Drying Time | Visible After Login | Visible After Login | |
| Fill Injection | Visible After Login | Visible After Login | |
| Front Zone Temperature | Visible After Login | Visible After Login | |
| Hold Pressure | Visible After Login | Visible After Login | |
| Injection Pressure | Visible After Login | Visible After Login | |
| Melt Temperature | Visible After Login | Visible After Login | |
| Moisture Content (Max) | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |
| Nozzle Temperature | Visible After Login | Visible After Login | |
| Rear Zone Temperature | Visible After Login | Visible After Login | |
| Screw Speed | Visible After Login | Visible After Login | |