Photo-Resin X004M by BASF is a UV-reactive, low-melting polyamide 6 (PA 6) grade. It has been specially optimized for stereolithography (SLA), digital light processing (DLP) and LCD printers. Exhibits high tensile strength and high elasticity modulus. Photo-Resin X004M is used in the area of ceramic photopolymers, which allow additive manufacturing of metal-casting molds for applications in aerospace and automotive sectors.
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