Epoxy, Epoxide (EP) Resin for Plastic Parts

CYCOM® EP1700 by Syensqo is a fast curing, process flexible epoxy resin system. It has good service temperature capability (>80°C), and offers on-tool time of 10 minutes or less. It is suitable for processing by compression molding, vacuum bags and autoclave.

• It shows compatibility with automated deposition technologies, including pick and place and low temperature VBO robustness.
• CYCOM® EP1700 is recommended for secondary structures in commercial airframes, from prototyping through to high-volume defence and aerospace applications.

GreenPoxy® 80 bio‑epoxy by Sicomin is a bio-based structural epoxy resin designed for high-performance composite manufacturing with high renewable content.

• It is designed for structural composite production requiring high mechanical performance.
• It is used in ski manufacturing to bond polyamide and ABS surfaces.
• GreenPoxy® 80 bio‑epoxy offers compatibility with existing molding and industrial processing methods.
• It provides durability under repeated impact and flex cycles.
• It helps maintain stability across extreme temperature ranges.
• It offers reliable mechanical strength when paired with SZ 8525 EVO hardener.
• It helps support development of lower-carbon composite materials.

DT220 by Toray is an advanced epoxy system designed to provide excellent thermo‑mechanical performance and high impact resistance. It ensures strong property retention at elevated temperatures, making it ideal for structural components exposed to very high service temperatures.

FR162V0 by Toray is a next‑generation halogen‑free flame‑retardant epoxy resin. It provides high flame resistance, excellent self‑extinguishing properties, and low heat release. Classified UL‑94 V0 at 1 mm laminate thickness, and compliant with FAR 25.853 and EN45545‑2. FR162V0 is ideal for battery enclosures and aircraft interior applications requiring stringent fire safety standards, with performance depending on laminate configuration.

EP21TDCSMed by Master Bond is a two component, silver filled, electrically conductive epoxy (EP) for bonding, sealing and coating. It offers convenient handling, high thermal conductivity, the ability to withstand thermal cycling and good strength properties.

• It is formulated to cure at room temperature or elevated temperatures with the optimum cure being overnight at room temperature followed by 2-3 hours at 150-200°F.
• It bonds well to a wide variety of substrates including metals, composites, glass, ceramics and many plastics.
• It has reasonably good strength in both shear and peel modes.
• It is specially formulated to be more forgiving than most epoxies and is capable of withstanding vigorous thermal cycling.
• It holds up very well to cleaning solutions and sterilants such as EtO and gamma radiation.
• It exhibits convenient mixing with a 1:1 weight ratio, contains no volatiles for excellent low outgassing properties, and allows for easy application with contact pressure curing, ensuring smooth and even spreading.
• It offers high bond strength to similar and dissimilar substrates, superior durability with thermal shock and chemical resistance, and is less rigid compared to conventional silver epoxy.
• EP21TDCSMed is used in medical electronic applications where superior conductivity and biocompatibility are important requirements.
• It has a shelf life of 3-6 months.
• It is RoHS complaint and USP Class VI certified.

EP42HT-2FG by Master Bond is an electrically insulating, two component epoxy (EP) system. It contains no solvents and diluents. Offers good resistance to chemicals, oil, fats, fuel, heat, steam and radiation. Exhibits low viscosity and high flow. It is formulated for food applications. Provides strong bonds to metals, plastics, rubbers and ceramics. Meets RoHS and NASA low outgassing specifications. It has a shelf life of 1 year in can and 6 months in syringes. EP42HT-2FG by Master Bond complies with FDA CFR 175.300 and 135.105 regulations.

EP17HTND-CCM by Master Bond is an electrically insulating, heat cured, one-component epoxy (EP) system. Resists many chemicals, such as acids, bases, fuels, salt and oils. Offers low shrinkage, thermal conductivity and high flow benefits. Also exhibits high solvent- and temperature resistance. Used for glob top and electronic applications. EP17HTND-CCM by Master Bond meets RoHS and NASA Low Outgassing regulation. It has a shelf life of 3-6 months.

EPON™ Resin 1163 by Westlake Epoxy is a highly brominated epoxy resin. It offers good flame resistance. It is used in electrical laminating, casting and molding applications. It is a reaction product of tetrabromobisphenol A and epichlorohydrin. It is characterized by its relatively low melt viscosity, excellent compatibility with epoxy resins, and effective flame-retardant performance. EPON™ Resin 1163 has a shelf life of 5 years.

Supreme 112 by Master Bond is an exceptionally low viscosity epoxy (EP) system for bonding, sealing, potting, encapsulation and impregnation. It requires elevated temperature curing. It offers exceptionally long open time, high glass transition temperature, toughness and slightly less rigidity.

• It bonds to a wide variety of substrates including metals, composites, glass, and many rubbers and plastics.
• It adheres especially well to glass, fibers and ceramics.
• It can withstand thermal cycling and mechanical stresses.
• It has strong & sturdy physical strength profile particularly tensile strength and retains electrical insulation profile even in harsh conditions.
• It shows good resistance to chemicals including water, oils, fuels, acids and bases.
• It is especially useful as it pertains to epoxy, composites and other fiber reinforced structures commonly used in pipes, storage tanks, aircraft as well as electronic devices.
• It can be used in numerous electrical applications such as transformers, switchgear components, resistors and many other electrical devices.
• It has a shelf life of 1 year in cans and 6 months in syringes.
• Supreme 112 is RoHS complaint and passes NASA low outgassing.

EPON™ Resin 828LS LC by Westlake Epoxy is a medium viscosity epoxy resin produced from bisphenol A resin and epichlorohydrin. It does not contain any modifier or reactive diluent. When cross-linked or hardened with appropriate curing agents, very good mechanical, adhesive, dielectric and chemical resistance properties are obtained. It has lower product color and lower hydrolysable chlorine content.

• EPON™ Resin 828LS LC is designed for epoxy applications.
• It is used in electrical and electronics applications (e.g. casting, encapsulating, etc.).