Unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. Primarily designed for use in solvent-based compositions. Compatible with all epoxy resins, including Bisphenol A and F epoxies and epoxy novolacs, can be used with diluted or undiluted resins, and compatible with a wide variety of fillers and pigments. Used as a curing agent for epoxy resins in powder epoxy coatings, electronic potting and encapsulating compounds.
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Omicure™ DDA 100 properties
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| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Melamine content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melting Point, Onset | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Moisture Content | 0.0 Visible After Login | Visible After Login | Visible After Login |