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EPALLOY® 8370 A85 by Huntsman is epoxy phenol novolac resin (85% solids in acetone). It combines low hydrolyzable chloride content with good reactivity. It is compatible with all standard curing agents and most resin systems. EPALLOY® 8370 A85 is suitable for high temperature encapsulation sealants and conductive adhesives. EPALLOY® 8220 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It provides low hydrolyzable chloride content, a high degree of reactivity and outstanding chemical resistance. It contains no diluent and is compatible with all standard curatives and most resin systems and solvents. EPALLOY® 8220 can be used in structural, general purpose, electronic encapsulants, laminates, industrial and construction (grouts) adhesives & sealants. EPALLOY® 7192 by Huntsman is an unmodified, high molecular weight Bisphenol-A based epoxy resin that is a semi-solid material at room temperature. It provides faster cure, improved adhesion, more durable cured systems and toughness, with somewhat reduced high temperature performance. EPALLOY® 7192 is used in structural, general purpose, industrial toughened adhesives. EPALLOY® 9237-70 by Huntsman is a very low viscosity, non-crystallizing, modified Bisphenol F resin. It combines low hydrolyzable chlorides with a high degree of reactivity and good chemical resistance. EPALLOY® 9237-70 is suitable for high temperature encapsulants and room curable adhesives. It is also used in construction (grouts, mortars) adhesives. EPALLOY® 8350 by Huntsman is epoxy phenol novolac resin exhibiting slightly higher viscosity. It is non-crystallizing and compatible with all standard curing agents and most resin systems and solvents. It has low hydrolyzable chlorides with good reactivity. EPALLOY® 8350 is used electrical potting and encapsulation adhesives. EPALLOY® 8230 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It combines low hydrolyzable chlorides with a high degree of reactivity and outstanding chemical resistance. It is non-crystallizing and compatible with all standard curatives and most resin systems and solvents. EPALLOY® 8230 can be used in automotive pumpable, electronic encapsulants and construction (anchor bolt, grouts & joint fillers) adhesives & sealants. EPALLOY® 9000 by Huntsman is epoxy resin based on tris-hydroxy phenyl ethane, exhibiting very low melt viscosity. It helps to produce very hard cured compositions with high thermal and chemical resistance. It can be used in epoxy formulations to increase tensile, flexural and compression strength. EPALLOY® 9000 is used in electronic encapsulation, aerospace composites and adhesives. EPALLOY® 7200 by Huntsman is a chemically modified liquid diglycidyl ether of Bisphenol-A epoxy resin. It is completely free of acrylates, designed for fast cure and low temperature applications. It provides very good chemical resistance, electrical and mechanical properties. EPALLOY® 7200 can be used in structural, general purpose, industrial and construction adhesives. EPALLOY® 8330 by Huntsman is a epoxy phenol novolac resin exhibiting lower viscosity than competitively available commercial alternates. It is non-crystallizing and compatible with all standard curing agents and most resin systems and solvents. EPALLOY® 8330 is used in high temperature encapsulant and conductive adhesives. EPALLOY® 7138 by Huntsman is a very low viscosity, non-crystallizing modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low hydrolyzable chlorides, high degree of reactivity, good chemical resistance and compatibility with all standard curatives, most resin systems and solvents. EPALLOY® 7138 can be used in structural, general purpose, electronic encapsulants, laminates, industrial and construction (grouts) adhesives & sealants.
EPALLOY®
Adhesive ingredients supplied by Huntsman