SILBOND® by HPF Minerals (Quarzwerke Group) is silane-treated fused silica filler. It is suitable for epoxy resin adhesives. It is used for electrical applications.
SILATHERM® 1466 by HPF Minerals (Quarzwerke Group) is a high-performance chemically inert, heat-resistant filler. It is particularly suitable for thermally conductive adhesives. It has an electrically insulating effect and improves the mechanical strength. It can reduce the thermal stress during bonding and, in addition, a permanent mechanical fixation can be achieved.
SILATHERM® Plus by HPF Minerals (Quarzwerke Group) is a chemically inert, heat-resistant filler. It is particularly suitable for thermally conductive adhesives. It has a thermal conductivity higher than 4 W/mK and low viscosity. It has an increased filling degree, an electrically insulating effect, and improves mechanical strength. It can reduce the thermal stress during bonding and, in addition, a permanent mechanical fixation can be achieved.
