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SSP 055 by Gelest (Mitsubishi Chemical) is a triethoxysilyl modified poly-1,2-butadiene, 50% in toluene. SSP 055 is used as coupling agent for EPDM resins. Trimethoxysilylpropyl modified polyethylenimine. Dimethoxysilylmethylpropyl modified polyethylenimine.
SSP
Adhesive ingredients supplied by Gelest (Mitsubishi Chemical)
3 Products match your search
SSP 055
by Gelest (Mitsubishi Chemical)
SSP 060
by Gelest (Mitsubishi Chemical)
SSP 065
by Gelest (Mitsubishi Chemical)
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