Finomide 1140 acts as a curing agent by Fine Orgokem. It is a high molecular weight, reactive polyamide resin. Finomide 1140 offers low mixing ratio and excellent binding capability. It is designed for epoxy-based adhesive application.
Finomide 1115 by Fine Orgokem is a high molecular weight, reactive polyamide resin. It provides low mixing ratio and excellent binding capability. It offers excellent corrosion resistance. Finomide 1115 is suitable for general purpose epoxy-based adhesives.
Finomide 1125 by Fine Orgokem acts as a curing agent. It is a high molecular weight, reactive polyamide resin. Finomide 1125 provides low mixing ratio and excellent binding capability. Recommended for epoxy-based adhesive application.
