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JAYHAWK™

Adhesive ingredients supplied by Evonik

6 Products match your search

JAYHAWK™ PMDA Ultrapure

by Evonik

Pyromellitic dianhydride. Acts as a curative for epoxy resins. It has low mix viscosity which helps in an easier incorporation of additives. Has a variable pot life for optimal processing and variable cure schedules to accommodate existing heating equipment. Provides optimum purity and particle size to meet specific requirements. Boosts the heat resistance of adhesives. Adhesives incorporating JAYHAWK™ dianhydrides exhibit the dimensional stability, adhesion and heat resistance required for the increasing design complexity of smartphones and tablets. It is a white/off-white colored powder. Can be used in admixtures with other anhydrides. Sensitive to acid formation in the presence of moisture. Exposure to air should be minimized in order to avoid quality and processing variations. Listed in TSCA.

JAYHAWK™ BTDA™ Microfine

by Evonik

3,3'4,4'-Benzophenonetetracarboxylic Dianhydride. Facilitates mixing in epoxy resins. Added as a co-monomer in polyimide synthesis in order to enhance thermal and fire resistance. Has a variable pot life for optimal processing and an optimum purity and particle size to meet specific requirements. It is a micronized, light-tan and free-flowing powder. Can be used in admixtures with other anhydrides. It is sensitive to acid formation in the presence of moisture. Exposure to air should be minimized in order to avoid quality and processing variations.

JAYHAWK™ BTDA™ Polymer Fine

by Evonik

3,3',4,4'-Benzophenonetetracarboxylic dianhydride. Acts as a curative for epoxy resins. It has low mix viscosity which helps in an easier incorporation of additives. Has a variable pot life for optimal processing and variable cure schedules to accommodate existing heating equipment. Provides optimum purity and particle size to meet specific requirements. Boosts the heat resistance of adhesives. Adhesives incorporating JAYHAWK™ dianhydrides exhibit the dimensional stability, adhesion and heat resistance required for the increasing design complexity of smartphones and tablets. It is a light-tan, free-flowing powder. Can be used in admixtures with other anhydrides. Sensitive to acid formation in the presence of moisture. Exposure to air should be minimized in order to avoid quality and processing variations. Listed in TSCA.

JAYHAWK™ BTDA™ Polymer Fine

by Evonik

3,3',4,4'-Benzophenonetetracarboxylic dianhydride. Added as a co-monomer in polyimide synthesis in order to enhance thermal and fire resistance. Has a variable pot life for optimal processing and an optimum purity and particle size to meet specific requirements. It is a light-tan, free-flowing powder. Can be used in admixtures with other anhydrides. It is sensitive to acid formation in the presence of moisture. Exposure to air should be minimized in order to avoid quality and processing variations. Listed in TSCA.

JAYHAWK™ PMDA Ultrapure

by Evonik

Pyromellitic dianhydride. Added as a co-monomer in polyimide synthesis in order to enhance thermal and fire resistance. Has a variable pot life for optimal processing and an optimum purity and particle size to meet specific requirements. Ideal for aerospace ducting and fuselage insulation. It is a white/off-white, high-purity, high-assay powder for increased polymer rigidity. Can be used in admixtures with other anhydrides. It is sensitive to acid formation in the presence of moisture. Exposure to air should be minimized in order to avoid quality and processing variations. Listed in TSCA.

JAYHAWK™ BTDA™ Microfine

by Evonik

3,3'4,4'-Benzophenonetetracarboxylic Dianhydride. Acts as a curative for epoxy resins. It has low mix viscosity which helps in an easier incorporation of additives. Has a variable pot life for optimal processing and variable cure schedules to accommodate existing heating equipment. Provides optimum purity and particle size to meet specific requirements. Boosts the heat resistance of adhesives. Adhesives incorporating JAYHAWK™ dianhydrides exhibit the dimensional stability, adhesion and heat resistance required for the increasing design complexity of smartphones and tablets. It is a light-tan, micronized, free-flowing powder. Can be used in admixtures with other anhydrides. Sensitive to acid formation in the presence of moisture. Exposure to air should be minimized in order to avoid quality and processing variations. Listed in TSCA.
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