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ADMAFINE® AO-502 by Admatechs acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low heat expansion and high heat conductivity. It exhibits wear resistance, heat resistance, dimensional stability and excellent surface roughness. ADMAFINE® AO-502 is suitable for optically clear adhesives, circuit board materials and di-attach adhesives. Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low heat expansion and high heat conductivity. It exhibits wear resistance, heat resistance, dimensional stability and excellent surface roughness. Suitable for optically clear adhesives, circuit board materials and di-attach adhesives. Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low heat expansion and high heat conductivity. It exhibits wear resistance, heat resistance, dimensional stability and excellent surface roughness. Suitable for optically clear adhesives, circuit board materials and di-attach adhesives. Alumina. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low heat expansion and high heat conductivity. It exhibits wear resistance, heat resistance, dimensional stability and excellent surface roughness. Suitable for optically clear adhesives, circuit board materials and di-attach adhesives. Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low heat expansion and high heat conductivity. It exhibits wear resistance, heat resistance, dimensional stability and excellent surface roughness. Suitable for optically clear adhesives, circuit board materials and di-attach adhesives. Low a-silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low heat expansion and high heat conductivity. It exhibits wear resistance, heat resistance, dimensional stability and excellent surface roughness. Suitable for optically clear adhesives, circuit board materials and di-attach adhesives. Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low heat expansion and high heat conductivity. It exhibits wear resistance, heat resistance, dimensional stability and excellent surface roughness. Suitable for optically clear adhesives, circuit board materials and di-attach adhesives. Low a-silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low heat expansion and high heat conductivity. It exhibits wear resistance, heat resistance, dimensional stability and excellent surface roughness. Suitable for optically clear adhesives, circuit board materials and di-attach adhesives. Silica. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low heat expansion and high heat conductivity. It exhibits wear resistance, heat resistance, dimensional stability and excellent surface roughness. Suitable for optically clear adhesives, circuit board materials and di-attach adhesives. Alumina. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low heat expansion and high heat conductivity. It exhibits wear resistance, heat resistance, dimensional stability and excellent surface roughness. Suitable for optically clear adhesives, circuit board materials and di-attach adhesives.
ADMAFINE®
Adhesive ingredients supplied by Admatechs