Technical datasheet

Naugard® HM-11

Supplied bySI Group- Last Updated on May 30, 2013

Non-dusting, granular blend of hindered phenolic and diphenylamine antioxidants. Used in polyamide hot melt adhesives. Provides synergistic short and long-term thermal protection against oxidation in polypropylene. Offers very good color and viscosity stability, gelation and skinning resistance in SIS, SBS, EVA and PE. Possesses low volatility and compatibility with polymer and rosin ester.
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For which system

Hot-melt Adhesives|
Adhesives

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Naugard® HM-11 properties

Other properties

PropertiesValue & unitTest conditionTest method
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