Functional Acrylic Resin. Exhibits excellent heat resistance and good adhesive properties. Has low ionic impurity which helps improve insulation properties. Possess low moisture absorption so as to ensure electric reliability. It has less color, ultrahigh molecular weight and is highly transparent. Manufactured by a unique suspension polymerization process. Used as a constituent element in adhesives for electronics-related products such as semiconductor packages and printing wiring boards.
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Adhesives
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KH-CT-865 properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Absorption rate (at 85ºC/85%) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Glass Transition Temperature (Tg) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Ionic impurity, Cl-, (Extracted at 120ºC for 24hrs), | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Ionic impurity, Na+, (Extracted at 120ºC for 24hrs), | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Molecular Weight, Mw | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Peel strength, [Cu/PI] | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Peel strength, [PI/PI] | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Solid Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Thermal decomposition temperature (TG-DTA) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Viscosity | 0.0 Visible After Login | Visible After Login | Visible After Login |