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EP21TDCS-LO by Master Bond is a two component, silver filled, electrically conductive epoxy for high performance bonding and sealing. It is 100% reactive and does not contain any diluents or solvents. It is formulated to cure at room
temperature or more rapidly at elevated temperatures.
- It bonds well with variety of substrates including metals, composites, glass, ceramics and many plastics.
- It offers good thermal, electrical conductivity, excellent toughness, high strength and low volume resistance.
- It resists thermal cycling and has a one-to-one mix ratio by weight or volume.
- It is used for aerospace, optical, electro-optic, semiconductor and OEM applications.
- It has a shelf life of 3-6 months.
- EP21TDCS-LO is cryogenically serviceable down to 4K and meets RoHS and NASA Low Outgassing specifications.
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EP21TDCS-LO properties
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| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Hardness, Shore D | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Low Shrinkage | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Mixing Ratio, Parts A to B | 0.0 Visible After Login | Visible After Login | Visible After Login |
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| Tensile Lap Shear Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
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| Thermal Conductivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Working Life After Mixing | 0.0 Visible After Login | Visible After Login | Visible After Login |