Adhesive ingredients for Electrical & Electronic Bonding

KANEKA XMAP™ by Kaneka is a solvent-free, liquid telechelic polyacrylate polymer. It has a crosslinking functional group at both ends. It exhibits high performance after curing.

• Its viscosity, weatherability, and mechanical properties can be adjusted by the blending ratio.
• It offers excellent transparency, flexibility, heat resistance, and oil resistance in combination with oil-resistant grade.
• It reduces the life cycle costs due to ultra-high durability.
• It is miscible with epoxy resin to give clear material even after curing.
• It is recommended for adhesive, gasket, potting and low-hardness UV-cure sealing materials.
• It offers higher elongation and toughness.
• It provides a high gel percentage and low compression set.
• It saves energy in the processing process by UV-curing on-site molding.
• It is suitable for super durable 1K and 2K construction sealant.
• It offers non-staining characteristics (no volatile silicone).
• It is used in oil and chemical resistance sealants, and glazing sealant, especially for self-cleaning glass (SCG).
• KANEKA XMAP™ is suitable for automotive, electric and electronic applications.
• It is used in various regions of Japan, Asia, the United States, and Europe.

Cardolite® NC-514 is a diglycidyl ether epoxy resin. Cardolite® NC-514 provides excellent flexibility, outstanding water resistance, and increased bond strength on difficult substrates like wet or oily surface. Cardolite® NC-514 is considered bio-based alternative for Bis-A based epoxy resin. It is recommended for 1K/2K epoxy adhesives and sealants as a toughener. It is used in industrial, transportations, and electrical/electronic adhesives to provide toughness, flexibility and water resistance.

Cardolite® NX-2026 is a high purity cardanol, bio-based diluent, resin modifier, and accelerator designed for use in adhesives and sealants. It is based on natural, renewable, non-food raw material feedstock. Exhibits very low viscosity, low volatility, excellent water resistance and corrosion protection originating from its chemical structure, long hydrophobic aliphatic chain and aromatic ring. Cardolite® NX-2026 is suitable to be used as a diluent and an accelerator for epoxy adhesives and an isocyanate blocking agent. In adhesive formulation, Cardolite® NX-2026 can improve workability by reducing viscosity and help to achieve fast cure in solvent free formulations. It is recommended for 2K Epoxy adhesives, pressure sensitive adhesive, hot melt adhesives for fabric lamination, 1K/2K epoxy-PU hybrid adhesive, wood/ paper adhesives and industrial adhesive applications. The recommended use level of the product is <20% of total resin weight.

AOMA™ by Nippon Shokubai is a low viscosity methyl 2-((allyloxy)methyl) acrylate monomer and exhibits high dilutability, excellent dispersibility and quick UV curability & reactivity.

• It offers flexibility, improved wettability, penetration, easier application & handling, smooth finish, enhanced processability and cost effectiveness.
• It has the ability to be copolymerized with other monomers to tailor the properties of the adhesive to specific applications, such as varying the glass transition temperature (Tg), tack and resistance to chemicals, heat and UV light.
• It provides faster curing times, energy efficiency, impact resistance, waste reduction, durability, consistency & reliability, improved aesthetics, long term stability and improved safety.
• It facilitates high solid formulations and enables the addition of more fillers or reinforcements.
• It shows toughness and excellent adhesion to various organic and inorganic substrates, making it ideal for bonding different types of substrates.
• It can be used in UV-curable adhesives for electronic materials.
• It is compatible with glass, aluminum, copper, ITO evaporated glass, silicon wafer, PMMA, PC, ABS and PET-, PA-, COP-, EVA-, TAC- and specialty acrylate films.
• AOMA™ is suitable for high performance adhesives and sealant applications.
• It is registered in US, EU, Japan, China, South Korea and Taiwan.

Cardolite® Ultra LITE 513 by Cardolite is a low viscosity, mono-functional epoxy reactive diluent. The long hydrophobic aliphatic side chain of cardanol gives this product a very low viscosity and provides excellent water resistance, flexibility, and thermal shock resistance. High viscosity solvent or solvent-free formulations can achieve enhanced workability and higher solids without sacrificing other performance properties using this product. Recommended use level for Cardolite® Ultra LITE 513 is 2-20% of total resin weight. It is an excellent alternative to glycidyl ether diluents because of favorable health hazard labeling, hydrophobicity, and mechanical properties. Used in 1K/2K epoxy adhesives including transportations, industrials and electronics sectors.

Cardolite® NC-513 is a low viscosity, mono-functional epoxy reactive diluent by Cardolite. The long hydrophobic aliphatic side chain of cardanol gives this product a very low viscosity and provides excellent water resistance, flexibility, and thermal shock resistance. High viscosity solvent or solvent-free formulations can achieve enhanced workability and higher solids without sacrificing other performance properties using this product. Recommended use level for Cardolite® NC-513 is 2-20% of total resin weight. It is an excellent alternative to glycidyl ether diluents because of favorable health hazard labeling, hydrophobicity, and mechanical properties. Cardolite® NC-513 are used in 1K/2K epoxy adhesives including transportations, industrials and electronics sectors.

Oppanol® N PLUS by BASF is a polyisobutene-based binder for next-generation of electric vehicle (EV) batteries. It is designed for use in cathodes, anodes and electrolytes, where it reliably holds individual components together while keeping them effectively separated.

• It possesses high elasticity and extensibility to compensate for mechanical stress generated during charging and discharging.
• It is chemically inert, helps reduce unwanted side reactions, and supports battery stability and longer service life.
• Oppanol® N PLUS exhibits very narrow product specifications and consistent quality, enabling reduced process variability, lower reformulation requirements, decreased quality control efforts, and faster and stable process adjustments.

Cardolite® LITE 513DF by Cardolite is a low viscosity epoxy reactive diluent and modifier based on cashew nutshell liquid (CNSL) technology. It has long hydrophobic aliphatic side chain which provides excellent water- and thermal shock resistance.

• It is an excellent alternative to difunctional diluents for increased strengths and hydrophobicity.
• Used for transportations, industrials, constructions and electronics applications.
• Partial substitution of liquid epoxy (Bis-A) with Cardolite® LITE 513DF offers well balanced mechanical strength and flexibility while increasing bio-content.
• The recommended usage levels can be 30-100% in reactive systems such as 1K and 2K epoxy adhesives and sealants.

FORAL™ 85-E Ester of Hydrogenated Rosin by Synthomer is a pale, thermoplastic ester resin derived from glycerol and a highly stabilized rosin. Offers advantages as the tackifier or modifier resin in various adhesives compositions. Exhibit light color, low odor with resistance to oxidation and to discoloration caused by heat and aging.

• It has a high degree of color retention, oxidation resistance, medium softening point and exceptional cutaneous tolerance.
• FORAL™ 85-E Ester of Hydrogenated Rosin is also used in UV cured acrylics to improve adhesion to low surface energy substrates.
• It shows compatibility with natural-, synthetic- and chlorinated rubber, ethylcellulose, EVA copolymers, low molecular weight polyethylene, SIS and SBS block copolymers, APAO, acrylic resins, polyamide resins, polyurethane compounds and with PVP, polyvinylbutyral, nitrocellulose, drying oils and alkyd resins.
• Recommended for caulks and sealants, labels, roofing, specialty tapes, assembly, hygiene adhesives, packaging and other adhesive applications.

Dynasylan® 1124 by Evonik acts as an adhesion promoter and surface modifier with excellent crosslinking properties. It is a secondary aminofunctional methoxy-silane possessing two symmetric silicon atoms. It provides improved flexural strength, tensile strength, impact strength, modulus of elasticity, moisture-, heat-damp-, and corrosion-resistance.

• It offers improvement in wet-out, homogeneous distribution of inorganic fillers in polymer matrices, rheological behavior like reduction in viscosity and newtonian behavior.
• It exhibits excellent primerless adhesion and high filler loading.
• It shows adhesion with lightweight materials.
• Dynasylan® 1124 is listed in DSL/NDSL, PICCS, TSCA, IECSC/TCSI, ECL, EINECS/ELINCS/SWISS, AICS and NZIoC.
• It has a minimum shelf life of 12 months.