Aluminum Oxides

ADMAFINE® AO-502 by Admatechs acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low heat expansion and high heat conductivity. It exhibits wear resistance, heat resistance, dimensional stability and excellent surface roughness. ADMAFINE® AO-502 is suitable for optically clear adhesives, circuit board materials and di-attach adhesives.

AEROXIDE® Alu C by Evonik is a fine particulate, pure, crystalline aluminium oxide used in adhesives. It can be used as a catalyst substrate. It exhibits high surface area, high purity, low water content, high thermal and chemical stability. AEROXIDE® Alu C provides homogeneous light emission, better flowability, improved chargeability and high gloss.

AEROXIDE® Alu 65 by Evonik is a highly dispersed fumed and fine pyrogenic metal oxide with a high surface area. It provides benefits such as homogenous light emission, better flowability, improved chargeability and high gloss. AEROXIDE® Alu 65 is suitable for adhesive applications.

Alumina. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low heat expansion and high heat conductivity. It exhibits wear resistance, heat resistance, dimensional stability and excellent surface roughness. Suitable for optically clear adhesives, circuit board materials and di-attach adhesives.

Alumina. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low heat expansion and high heat conductivity. It exhibits wear resistance, heat resistance, dimensional stability and excellent surface roughness. Suitable for optically clear adhesives, circuit board materials and di-attach adhesives.

Alumina. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low heat expansion and high heat conductivity. It exhibits wear resistance, heat resistance, dimensional stability and excellent surface roughness. Suitable for optically clear adhesives, circuit board materials and di-attach adhesives.

Alumina. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low heat expansion and high heat conductivity. It exhibits wear resistance, heat resistance, dimensional stability and excellent surface roughness. Suitable for optically clear adhesives, circuit board materials and di-attach adhesives.

Alumina. Acts as a filler. It is in form of microscopic spherical oxide particles. It has low moisture content, excellent dispersability, low surface area and high purity. It is rigid, possesses low heat expansion and high heat conductivity. It exhibits wear resistance, heat resistance, dimensional stability and excellent surface roughness. Suitable for optically clear adhesives, circuit board materials and di-attach adhesives.

Aluminium Oxide C by Evonik is used in water-based neoprene and EVA adhesives. It provides anti-sagging, thixotropic, stabilizing effects, reinforcement and pigment suspension.