Precision Innovations in Semiconductor Solutions: JNC's UV-Curable Inks

Navigating the challenges inherent in semiconductor manufacturing, JNC presents a groundbreaking solution to revolutionize wafer protection. The focus is on achieving the delicate equilibrium between ideal thermal curing and heat slide debonding.

Traditional methods of wafer protection often face the dilemma of either perfect outcomes with hindered debonding or compromised adhesion due to inadequate curing. JNC's answer to this challenge is the introduction of UV-Curable Inks, a transformative solution tailored for MEMS and semiconductor manufacturing.​

This innovative solution brings a multitude of benefits, including:

Use Case:

Bulk micro-machining demands the use of a support wafer to prevent device wafer breakage during processing. JNC's PA-1600-001 , efficiently acting as a temporary adhesive, make the process seamless, ensuring efficient removal of the support wafer afterward.

BASIC PROPERTIES

CURING CONDITIONS

HEAT SLIDE DEBONDING TEST

SOLUBILITY TEST