JNC PA-1510-005: Inkjetable solution for Wafer Etching & Dicing in Semiconductor and MEMS Process

JNC injektable PA-1510-005 protects the edges of each die and serves to prevent cracking and chipping during the dicing process. Importantly, the applied inks can be easily removed with alkaline solution after the manufacturing process is complete. These advantages collectively enhance mass production yields, ensuring a more efficient and successful manufacturing process.

JNC inkjetable PA-1510-005 protects the edges of each die and serves to prevent cracking and chipping during the dicing process. Importantly, the applied inks can be easily removed with alkaline solution after the manufacturing process is complete. These advantages collectively enhance mass production yields, ensuring a more efficient and successful manufacturing process.

USE CASE 1

Wafer Protection during Dicing with PA-1510-005:

• No cracking or chipping due to low residual stress
• Better yield and device reliability

Modulus GPa: 1 | Elongation: 2 | Residual stress:

USE CASE 2

Ability to create 3D objects with elevated aspect ratios using the method outlined below.
MEMS applications:

INK-JETTING DEMONSTRATION EXAMPLES

Possibility to produce 3D objects with high aspect ratios through inkjet printing, as illustrated below, in approximately 30 minutes. Process materials for semiconductor: Example of printed pillar / wall patterns with high aspect ratio (height / width = >1).

CHARACTERISTICS

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