New high heat-resistant Polyimide film: Outstanding dimensional stability, thinner thickness and excellent smooth surface

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Type of Solution sought

Novel versatile Polyimide (PI) Films outperform existing similar products offering a greater resistance to extreme temperatures – up to 500°C, combined with a variety of additional unique features.

Who might be interested?
If you need to use a high-performance film for demanding applications and challenging environment and to improve heat stability, insulation, flexibility, flatness, processability, thinness, thermal conductivity …
…discover and test this new PI film before market launch!

Description of Desired Solution

Novel versatile Polyimide (PI) Films outperform existing similar products offering a greater resistance to extreme temperatures – up to 500°C, combined with a variety of additional unique features.

Detailed Solution Description

This one-of-a-kind Polyimide (PI) film has been designed to meet the requirements of high-performance end applications:

Benefits

Extremely high heat resistance:
stable film at up to 500°C!
Outstanding dimensional stability:
CTE very close to glass!
Very low warpage:
at up to 500°C!
Greater surface smoothness:
0.5nm vs 3nm of existing PI films!
Easily laminated on various substrates:
glass, metal (Cu, SUS, etc.), fluorine…

Outstanding high heat stability compared to benchmark

Film status after hot plate (5 min)

high heat stability

Coefficient of Thermal Expansion (CTE) same as glass over 400℃

ctegraph

Various thickness:
38µm single film | 15µm single film | 5µm single film | Up to several mm multilayer film

Key performance characteristics

Young’s Modulus
Tensile Strength
Elongation at break
Heat Shrinkage 400°C, 2h
CTE
Density
Surface Roughness (Ra)
Temperature resistance

9 GPa
450 MPa
40 %
3 ppm / °C
1.5 g / cm3
0.5 nm
~500°C

Additional data available on demand:
- Comparative data vs conventional PI films and glass
- Surface smoothness related data