Chemical foaming agent. Characterized by endothermic decomposition beginning @ 135°C. Used for applications where lower processing temperatures are used that require uniform cell structure with good density reduction. Maximum gas yields are achieved when processing temperatures of 175- 230°C ( 347-446°F) are reached. Usage level of injection molding is 0.5- 4% for chemical foaming whereas usage level of extrusion is 0.75- 3.5% for chemical foaming.
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| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Decomposition Temperature | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Processing temperatures | 0.0 Visible After Login | Visible After Login | Visible After Login |