Technical datasheet
RESIFA™ SOLESPHERE™ HS-200
Supplied byAGC Chemicals Americas- Last Updated on Sep 4, 2023
RESIFA™ SOLESPHERE™ HS-200 by AGC Chemicals Americas is a microspherical silica fillers. It provides superior low Dk and low Df performance. It helps to minimize electric power loss and signal loss.
- It exhibits low transmission loss, signal stability and stable along a wide temperature range.
- RESIFA™ SOLESPHERE™ HS-200 is suitable for copper clad laminates, PCB boards, films and molded plastics.
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RESIFA™ SOLESPHERE™ HS-200 properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dielectric Constant | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dielectric Tangent | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Particle Size | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Particle Size | 0.0 Visible After Login | Visible After Login | Visible After Login |