Technicure® Nano-Dicy is a pulverized grade of dicyandiamide. Acts as a curing agent. Used in composites such as pre-pregs and powder coatings applications.
- Provides excellent adhesion to a variety of substrates and has high glass transition temperature.
- Technicure® Nano-Dicy contains fumed silica to prevent clumping and improve flow.
- Its extremely fine particle size leads it to more fully allowing a faster cure without sacrificing formulation shelf stability.
- Can be used with accelerators to lower the temperature of initiation.
- The type and loading level of an accelerator will provide an excellent balance of low-temperature reactivity and formulation shelf stability.
- The recommended use level with epoxy resin (EEW=190) is between 3-8 phr.
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Technicure® Nano-Dicy properties
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