Dynamar™ HC 1101 by 3M has demonstrated benefits in specialized extrusion and calendaring processes. It is useful at reducing die pressure, reducing die build-up, and promoting release from calendaring rolls.
- It exhibits melt fracture elimination, die build-up reduction, gel reduction, improved pigment dispersion.
- This epoxy curative is a linear polyether di-primary amine which contains tetramethylene oxide as the principal recurring unit and has a molecular weight of approximately 10,000.
- It has high tensile strength, elongation and hydrolytic stability.
- It has adhesion properties like epoxy resins and excellent abrasion resistance.
- It offers high resilience and low heat build-up during dynamic use.
- Dynamar™ HC 1101 has a wide range of available hardness.
| Chemical Composition: | Visible After Login |
| Bio Based content | Visible After Login |
| Appearance | Visible After Login |
Compliance
No data available
Applications
Recommended markets
Applications
Conversion mode
For which polymer
Availability
Product Status:Visible After Login
Dynamar™ HC 1101 properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Amine Number | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Density, Melt | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Viscosity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volatile Content | 0.0 Visible After Login | Visible After Login | Visible After Login |