LNP™ THERMOCOMP™

Plastics and elastomers supplied by SABIC

LNP™ THERMOCOMP™ broad range of resins comprises polyetherimide (PEI) resin, polyetheretherketone (PEEK), polyamides (PA), polyphenylene sulfide (PPS), and melt processible fluoropolymers by SABIC. Used in demanding high-temperature and chemical environments

Key benefits of LNP™ THERMOCOMP™ brand include:

Strength and stiffness
Specific gravity for weight management or solid feel
Heat and chemical resistance
Good flow and dimensional stability
Contains reinforced additives like glass fiber, carbon fiber, glass beads, and minerals
Available in a wide range of opaque colors for improved aesthetics

857 Products match your search

LNP™ THERMOCOMP™ Compound UF008H

by SABIC

LNP™ THERMOCOMP™ Compound UF008H by SABIC is a compound based on PFAS-free, polyphthalamide (PPA) resin that contains 40% glass fiber. It exhibits high stiffness, strength and heat resistance. This grade is processed by injection molding. LNP™ THERMOCOMP™ Compound UF008H is suitable for pharmaceutical- & industrial packaging, drug delivery, surgical devices, general healthcare and patient testing.

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LNP™ THERMOCOMP™ Compound NX10302

by SABIC

LNP™ THERMOCOMP™ Compound NX10302 by SABIC is a compound based on PFAS-free, blend of polycarbonate (PC) and acrylonitrile butadiene styrene (ABS) containing proprietary fillers like talc. It offers dielectrics, improved plating surface and mechanical performance targeted for laser direct structuring applications. It is processed by injection molding. LNP™ THERMOCOMP™ Compound NX10302 is recommended for automotive interiors, personal accessory, consumer applications, electrical industry and electronic applications like mobile phones, computers and tablets.

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LNP™ THERMOCOMP™ Compound RX10405H

by SABIC

LNP™ THERMOCOMP™ Compound RX10405H by SABIC is a compound based on PFAS-free, electrically conductive, nylon 6/6 resin that is filled with 40% carbon fiber. It exhibits high stiffness and strength. It is processed by injection molding. LNP™ THERMOCOMP™ Compound RX10405H is recommended for pharmaceutical & industrial packaging, drug delivery, surgical devices, general healthcare and patient testing.

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LNP™ THERMOCOMP™ Compound MF006SXP (Europe)

by SABIC

LNP™ THERMOCOMP™ Compound MF006SXP (Europe) by SABIC is a compound based on PFAS-free, heat stabilized, unspecified polypropylene resin that is reinforced with 30% glass fiber. It exhibits high stiffness & strength. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound MF006SXP (Europe) is used in consumer applications like sports/leisures, personal accessory, electrical industry and electronic applications such as mobile phones, computers and tablets.

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LNP™ THERMOCOMP™ Compound WC006 (Americas)

by SABIC

LNP™ THERMOCOMP™ Compound WC006 (Americas) by SABIC is a compound based on PFAS-free, electrically conductive, PBT resin that is filled with 30% carbon fiber. It exhibits high stiffness & strength. This grade is processed by injection molding. It is recommended for building components and constructions, consumer applications like sports/leisures, personal accessory and home & commercial appliances. LNP™ THERMOCOMP™ Compound WC006 (Americas) is suitable for electrical industry and electronic applications such as mobile phones, computers and tablets.

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LNP™ THERMOCOMP™ Compound RF00CSXS (Europe)

by SABIC

LNP™ THERMOCOMP™ Compound RF00CSXS (Europe) by SABIC is a compound based on PFAS-free, heat stabilized, nylon 6/6 resin that is filled with 60% glass fiber. It exhibits high stiffness & strength. This grade is processed by injection molding. It is recommended for building components and constructions, consumer applications like sport/leisures, personal accessory and home & commercial appliances. LNP™ THERMOCOMP™ Compound RF00CSXS (Europe) is suitable for electrical industry and electronic applications such as mobile phones, computers and tablets.

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LNP™ THERMOCOMP™ Compound RF006

by SABIC

LNP™ THERMOCOMP™ Compound RF006 by SABIC is a compound based on PFAS-free, nylon 6/6 resin that is filled with 30% glass fiber. It exhibits high stiffness & strength. This grade is processed by injection molding. It is recommended for building components and constructions, consumer applications like sport/leisures, personal accessory and home & commercial appliances. LNP™ THERMOCOMP™ Compound RF006 is suitable for electrical industry and electronic applications such as mobile phones, computers and tablets.

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LNP™ THERMOCOMP™ Compound OF008A (Asia)

by SABIC

LNP™ THERMOCOMP™ Compound OF008A (Asia) by SABIC is a compound based on PFAS-free, 40% glass fiber reinforced, branched polyphenylene sulfide (PPS) resin. It shows high strength & stiffness. It is processed by injection molding. LNP™ THERMOCOMP™ Compound OF008A (Asia) is used in consumer applications like personal accessory, sports/leisures and home & commercial appliances. It is suitable for electrical industry and electronic applications such as mobile phones, computers and tablets and buildings & constructions.

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LNP™ THERMOCOMP™ Compound WF004 (Europe)

by SABIC

LNP™ THERMOCOMP™ Compound WF004 (Europe) by SABIC is a compound based on PFAS-free, PBT resin that is filled with 20% glass fiber. It exhibits high stiffness & strength. This grade is processed by injection molding. It is recommended for building components and constructions, consumer applications like sports/leisures, personal accessory and home & commercial appliances. LNP™ THERMOCOMP™ Compound WF004 (Europe) is suitable for automotive under the hood, electrical industry and electronic applications such as mobile phones, computers and tablets.

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LNP™ THERMOCOMP™ Compound UF00BAS

by SABIC

LNP™ THERMOCOMP™ Compound UF00BAS by SABIC is a compound based on PFAS-free, polyphthalamide (PPA) resin that is filled with 50% glass fiber. This heat stabilized grade exhibits high stiffness, strength and heat resistance. It is processed by injection molding. It is recommended for automotive under the hood and consumer applications like commercial appliances. LNP™ THERMOCOMP™ Compound UF00BAS is suitable for electrical industry and electronic components like mobile phones, computers and tablets.