LNP™ THERMOCOMP™

Plastics and elastomers supplied by SABIC

LNP™ THERMOCOMP™ broad range of resins comprises polyetherimide (PEI) resin, polyetheretherketone (PEEK), polyamides (PA), polyphenylene sulfide (PPS), and melt processible fluoropolymers by SABIC. Used in demanding high-temperature and chemical environments

Key benefits of LNP™ THERMOCOMP™ brand include:

Strength and stiffness
Specific gravity for weight management or solid feel
Heat and chemical resistance
Good flow and dimensional stability
Contains reinforced additives like glass fiber, carbon fiber, glass beads, and minerals
Available in a wide range of opaque colors for improved aesthetics

857 Products match your search

LNP™ THERMOCOMP™ Compound AC004

by SABIC

LNP™ THERMOCOMP™ Compound AC004 by SABIC is a compound based on PFAS-free, electrically conductive, acrylonitrile butadiene styrene (ABS) resin that is filled with carbon fiber. Provides high stiffness & strength. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound AC004 is used in building components & constructions and consumer applications like personal accessories & sports/leisures. LNP™ THERMOCOMP™ Compound AC004 is suitable for electrical industry and electronic applications such as mobile phones, computers and tablets.

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LNP™ THERMOCOMP™ Compound LX09404

by SABIC

LNP™ THERMOCOMP™ Compound LX09404 by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin containing 45% carbon fiber. This electrically conductive grade displays high modulus, stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LX09404 is recommended for consumer & commercial appliances, electrical industry and electronic components, mobile phones, computers and tablets and material handling.

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LNP™ THERMOCOMP™ Compound IF006L

by SABIC

LNP™ THERMOCOMP™ Compound IF006L by SABIC is a PFAS-free, low extractable polyamide 6-12 (nylon 6-12) reinforced with 30% glass fiber. It exhibits good high stiffness & strength. LNP™ THERMOCOMP™ Compound IF006L can be processed by injection molding. Recommended for water management, building & construction, food & beverage, home appliances, packaging and consumer applications. It is a food contact acceptable grade.

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LNP™ THERMOCOMP™ Compound MB006HS

by SABIC

LNP™ THERMOCOMP™ Compound MB006HS by SABIC is a compound based on PFAS-free, heat stabilized, low warpage, unspecified polypropylene (PP) resin that is filled with 30% glass beads. It offers high stiffness & strength. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound MB006HS is recommended for pharmaceutical & industrial packaging, drug delivery, surgical devices, general healthcare and patient testing.

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LNP™ THERMOCOMP™ Compound SF006

by SABIC

LNP™ THERMOCOMP™ Compound SF006 by SABIC is a compound based on PFAS-free, nylon 12 resin that is filled with 30% glass fiber. It exhibits high stiffness & strength. It is processed by injection molding. It is recommended for automotive under the hood and consumer applications like commercial appliances. LNP™ THERMOCOMP™ Compound SF006 is suitable for electrical industry and electronic components like mobile phones, computers and tablets.

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LNP™ THERMOCOMP™ Compound LF006EX1

by SABIC

LNP™ THERMOCOMP™ Compound LF006EX1 by SABIC is a PFAS-free compound based on polyetheretherketone (PEEK) resin containing 30% glass fiber. It exhibits low warpage, high modulus, easy molding properties and high stiffness & strength, high temperature resistance and good processability. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound LF006EX1 is recommended for commercial appliance, consumer goods, electronic components, mobile phone, computer and tablets, electrical industry and material handling applications.

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LNP™ THERMOCOMP™ Compound QC006 (Asia)

by SABIC

LNP™ THERMOCOMP™ Compound QC006 (Asia) by SABIC is a compound based on PFAS-free, electrically conductive, nylon 6/10 resin that is filled with 30% carbon fiber. It exhibits high stiffness & strength. This grade is processed by injection molding. It is recommended for building components and constructions, consumer applications like sports/leisures, personal accessory and home & commercial appliances. LNP™ THERMOCOMP™ Compound QC006 (Asia) is suitable for electrical industry and electronic applications such as mobile phones, computers and tablets.

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LNP™ THERMOCOMP™ Compound DC0041PQ

by SABIC

LNP™ THERMOCOMP™ Compound DC0041PQ by SABIC is a flame-retarded, structural, light-weight polycarbonate (PC) grade reinforced with 20% super strong carbon fiber. It contains talc and provides high stiffness and mold release benefits. Exhibits electrical conductivity and good processability. It is a heat stabilizer, non-brominated and non-chlorinated grade. Applicable for outdoor, lawn, landscape, consumer goods, electrical devices and displays. Other applications include personal accessory, electrical components, infrastructure and electronics. LNP™ THERMOCOMP™ Compound DC0041PQ is suitable for processing by injection molding.

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LNP™ THERMOCOMP™ Compound KB006

by SABIC

LNP™ THERMOCOMP™ Compound KB006 by SABIC is a compound based on PFAS-free, acetal (POM) copolymer resin that is reinforced with 30% glass beads. It exhibits low warpage and high stiffness & strength. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound KB006 is used in constructions, buildings, water management, consumer applications like personal accessory and sports/leisures. It is suitable for electrical industry and electronic applications such as mobile phones, computers and tablets.

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LNP™ THERMOCOMP™ Compound LF006E (Europe)

by SABIC

LNP™ THERMOCOMP™ Compound LF006E (Europe) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 30% glass fiber. It offers easy molding, good processability, high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF006E (Europe) is recommended for consumer applications, commercial appliances, electrical industry and electronic components, mobile phones, computers, tablets and material handling.