LNP™ THERMOCOMP™

Plastics and elastomers supplied by SABIC

LNP™ THERMOCOMP™ broad range of resins comprises polyetherimide (PEI) resin, polyetheretherketone (PEEK), polyamides (PA), polyphenylene sulfide (PPS), and melt processible fluoropolymers by SABIC. Used in demanding high-temperature and chemical environments

Key benefits of LNP™ THERMOCOMP™ brand include:

Strength and stiffness
Specific gravity for weight management or solid feel
Heat and chemical resistance
Good flow and dimensional stability
Contains reinforced additives like glass fiber, carbon fiber, glass beads, and minerals
Available in a wide range of opaque colors for improved aesthetics

857 Products match your search

LNP™ THERMOCOMP™ Compound LX09404

by SABIC

LNP™ THERMOCOMP™ Compound LX09404 by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin containing 45% carbon fiber. This electrically conductive grade displays high modulus, stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LX09404 is recommended for consumer & commercial appliances, electrical industry and electronic components, mobile phones, computers and tablets and material handling.

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LNP™ THERMOCOMP™ Compound LF006EX1

by SABIC

LNP™ THERMOCOMP™ Compound LF006EX1 by SABIC is a PFAS-free compound based on polyetheretherketone (PEEK) resin containing 30% glass fiber. It exhibits low warpage, high modulus, easy molding properties and high stiffness & strength, high temperature resistance and good processability. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound LF006EX1 is recommended for commercial appliance, consumer goods, electronic components, mobile phone, computer and tablets, electrical industry and material handling applications.

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LNP™ THERMOCOMP™ Compound OF008E (Asia)

by SABIC

LNP™ THERMOCOMP™ Compound OF008E (Asia) by SABIC is a compound based on PFAS-free, 40% glass fiber reinforced, polyphenylene sulfide (PPS) resin. It shows good processability, easy molding and high strength & stiffness. It is processed by injection molding. It is used in consumer applications like personal accessory, sports/leisures and home & commercial appliances. LNP™ THERMOCOMP™ Compound OF008E (Asia) is suitable for electrical industry and electronic applications such as mobile phones, computers and tablets and buildings & constructions.

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LNP™ THERMOCOMP™ Compound QC006 (Asia)

by SABIC

LNP™ THERMOCOMP™ Compound QC006 (Asia) by SABIC is a compound based on PFAS-free, electrically conductive, nylon 6/10 resin that is filled with 30% carbon fiber. It exhibits high stiffness & strength. This grade is processed by injection molding. It is recommended for building components and constructions, consumer applications like sports/leisures, personal accessory and home & commercial appliances. LNP™ THERMOCOMP™ Compound QC006 (Asia) is suitable for electrical industry and electronic applications such as mobile phones, computers and tablets.

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LNP™ THERMOCOMP™ Compound UF008H

by SABIC

LNP™ THERMOCOMP™ Compound UF008H by SABIC is a compound based on PFAS-free, polyphthalamide (PPA) resin that contains 40% glass fiber. It exhibits high stiffness, strength and heat resistance. This grade is processed by injection molding. LNP™ THERMOCOMP™ Compound UF008H is suitable for pharmaceutical- & industrial packaging, drug delivery, surgical devices, general healthcare and patient testing.

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LNP™ THERMOCOMP™ Compound PF006 (Asia)

by SABIC

LNP™ THERMOCOMP™ Compound PF006 (Asia) by SABIC is a compound based on PFAS-free, 30% glass fiber reinforced, nylon 6 resin. It shows high strength & stiffness. It is processed by injection molding. It is used in consumer applications like personal accessory, sports/leisures and home & commercial appliances. LNP™ THERMOCOMP™ Compound PF006 (Asia) is suitable for electrical industry and electronic applications such as mobile phones, computers and tablets and buildings & constructions.

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LNP™ THERMOCOMP™ Compound NX10302

by SABIC

LNP™ THERMOCOMP™ Compound NX10302 by SABIC is a compound based on PFAS-free, blend of polycarbonate (PC) and acrylonitrile butadiene styrene (ABS) containing proprietary fillers like talc. It offers dielectrics, improved plating surface and mechanical performance targeted for laser direct structuring applications. It is processed by injection molding. LNP™ THERMOCOMP™ Compound NX10302 is recommended for automotive interiors, personal accessory, consumer applications, electrical industry and electronic applications like mobile phones, computers and tablets.

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LNP™ THERMOCOMP™ Compound UX06032

by SABIC

LNP™ THERMOCOMP™ Compound UX06032 by SABIC is a compound based on PFAS-free, flame retarded, non chlorinated & brominated polyphthalamide (PPA) resin that is filled with 30% glass fiber. This heat stabilized grade offers high stiffness, strength and heat resistance. It is processed by injection molding. It is recommended for automotive under the hood and consumer applications like commercial appliances. LNP™ THERMOCOMP™ Compound UX06032 is suitable for electrical industry and electronic components like mobile phones, computers and tablets.

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LNP™ THERMOCOMP™ Compound LF002 (Americas)

by SABIC

LNP™ THERMOCOMP™ Compound LF002 (Americas) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 10% glass fiber. It offers high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF002 (Americas) is recommended for consumer applications, commercial appliances, electrical industry and electronic components, mobile phones, computers, tablets and material handling.

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LNP™ THERMOCOMP™ Compound LC004XXP

by SABIC

LNP™ THERMOCOMP™ Compound LC004XXP by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin filled with 20% carbon fiber. This electrically conductive grade offers high stiffness, strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LC004XXP is recommended for electrical industry and electronic components such as mobile phones, computers and tablets. It is suitable for material handling.