Syensqo launches low-density HPPA for consumer electronics industry
Last update on Oct 21, 2025
Syensqo announces the launch of Kalix® LD-4850 BK000, a new low-density high-performance polyamide (HPPA) developed to address the evolving demands of the consumer electronics industry.
Over 30% weight reduction
Kalix® LD-4850 enables manufacturers to achieve substantial lightweighting of structural components in devices such as smartphones, AR/VR headsets, and other smart electronics. The new grade delivers over 30% weight reduction compared to conventional structural polyamides and polycarbonates, while maintaining excellent mechanical strength and premium surface aesthetics.
Engineered for applications where reduced weight is essential, such as brackets, frames, speaker housings, and AR/VR glass legs, Kalix® LD-4850 combines high stiffness and strength with minimal warpage and low dielectric properties. This unique balance supports the development of slimmer, lighter, and more comfortable devices, in line with current hardware trends.
Explore Kalix® HPPA portfolio to replace metals in structural electronic components!
"With Kalix® LD-4850, Syensqo is empowering our customers to redefine what’s possible in consumer electronics design. By enabling significant weight reduction without sacrificing durability or visual appeal, this new HPPA grade helps manufacturers meet consumer expectations for portability and performance," Andrew Lau, senior executive vice president of Electronics & Industrial Syensqo Specialty Polymers.
Kalix® LD-4850 BK000 is now commercially available worldwide and has already been adopted by leading smartphone manufacturers.