Explore the insights of Supreme 3HTND-2DM, a rapid curing epoxy system used in chip on board encapsulation.
Thermally conductive and electrically insulating, this product meets NASA Low Outgassing specifications. Watch this short video to know more about this novel range and its benefits that makes it ideal compound for bonding and sealing.
Thermally conductive and electrically insulating, this product meets NASA Low Outgassing specifications. Watch this short video to know more about this novel range and its benefits that makes it ideal compound for bonding and sealing.
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