Master Bond's EP4EN-80 is a fast-curing epoxy especially for bonding and encapsulation applications. Approved under NASA Low Outgassing Specification, curable at a temperature as low as 80oC.
Its viscosity and strong adhesive strength makes it one of the best in encapsulating and gap-filling with quick cure profile. Watch this short video to get a detailed information about this product and its properties.
Its viscosity and strong adhesive strength makes it one of the best in encapsulating and gap-filling with quick cure profile. Watch this short video to get a detailed information about this product and its properties.
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