TFM-S05P by Toyal is a spherical, conductive filler. It contains silica as the core material. It offers uniform plating onto each individual particle. It provides superior conductivity, oxidation-, moisture resistance and inking characteristics. It possesses plating of metals, ceramics and organic matter and plating film variations like Au, Ag, Cu and Sn. TFM-S05P is applicable in conductive ink fillers and metal coating.
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TFM-S05P properties
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| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density, True | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Particle Size Distribution, Median | 0.0 Visible After Login | Visible After Login | Visible After Login |