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Master Bond introduces low-outgassing epoxy for aerospace use
May 05 2026
Formulators working on vacuum-compatible assemblies can evaluate Master Bond EP64, a two-component epoxy system launched by Master Bond designed for bonding, sealing, and coating applications in aerospace and electronic environments.
According to the company, Master Bond EP64 meets NASA low outgassing specifications per ASTM E595 testing and achieves a glass transition temperature of 210–215°C - a performance level reached through a two-stage cure schedule rather than elevated cure temperatures alone.





