How to improve fungus resistance in adhesives & sealants?
Last update on Jan 14, 2026
Fungus, like other microbes weaken the core performance properties of the adhesive leading to failure. The fungus works by breaking down the resin into smaller particles as a nutritional source to obtain carbon. Among other things, this degradation causes the adhesive, sealant or encapsulant to lose its ability to protect against chemical and moisture exposure.
Fungus-resistant adhesives primarily work by keeping the equipment pieces and electronic devices free from damage. One of the most robust ways of testing adhesives for fungus resistance is with the MIL-STD-810G with Change 1, Method 508.7 standard. This stringent military standard was developed by the U.S. Department of Defense1.
Find more on the MIL-STD-810G method: Masterbond explains
Types of potential failures
- Material degradation: Fungal activity leads to the breakdown of adhesive at the molecular level, weakening its physical properties.
- Electrical malfunctions: Fungal growth can sometimes form conductive pathways over insulating materials, leading to electrical malfunctions.
- Impeded movement of small components: Fungal colonization can cause small mechanical parts to stick together, hindering their movement.
- Moisture on hydrophobic surfaces: Fungal communities generate moisture in their surroundings, potentially causing additional harm to bonded components.
