Masterbond Thermoset Epoxy

Technical datasheet

Supreme 3CCM-85

Supplied byMaster Bond- Last Updated on Oct 15, 2025

Supreme 3CCM-85 by Master Bond is a toughened one component epoxy (EP) system. It can withstand various types of thermal cycling. It does not require any mixing prior to use and has unlimited working life at room temperature. It exhibits very long open time, thermally conductivity, very good electrical insulation and physical strength properties.
  • It bonds well to a wide variety of substrates used in electronics including metals, composites, ceramics and many plastics.
  • It is used for bonding, potting, sealing, coating, small encapsulation and glob top applications.
  • It is suitable for applications where heat curing above 200°F is not possible.
  • It has a shelf life of 3-6 months at 40-50°F in original, unopened containers.
  • Supreme 3CCM-85 is RoHS complaint.
Product family:
Chemical family:
Product Type:
Chemical Composition:Visible After Login
Bio Based contentVisible After Login
ColorVisible After Login
AppearanceVisible After Login

Documents related to Supreme 3CCM-85

No data available

Benefits

No data available

Compliance

Certifications & Compliance
Visible After Login

Applications

Recommended markets

Applications

For which system

Adhesives|
Sealants

Availability

Product Status:Visible After Login

Supreme 3CCM-85 properties

Other properties

PropertiesValue & unitTest conditionTest method
Hardness, Shore D0.0 Visible After LoginVisible After LoginVisible After Login
Service Temperature0.0 Visible After LoginVisible After LoginVisible After Login
Solid Content0.0 Visible After LoginVisible After LoginVisible After Login
Specific Gravity0.0 Visible After LoginVisible After LoginVisible After Login
Tensile Lap Shear Strength0.0 Visible After LoginVisible After LoginVisible After Login
Tensile Strength0.0 Visible After LoginVisible After LoginVisible After Login
Thermal Conductivity0.0 Visible After LoginVisible After LoginVisible After Login
Viscosity0.0 Visible After LoginVisible After LoginVisible After Login
Volume Resistivity0.0 Visible After LoginVisible After LoginVisible After Login

Related products