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EP3HTS-TC by Master Bond is a fast curing, silver-filled, one component epoxy (EP) system. It provides adhesion to a wide variety of substrates including metals, composites, ceramics and many plastics. It offers low coefficient of thermal expansion, good electrical and thermal conductivity.
- It exhibits good dimensional stability, minimal flow and low shrinkage upon curing.
- It has high viscosity and resists thermal cycling.
- It is not premixed and frozen and has an unlimited working life at room temperature.
- It can be used for sealing, die attach and general bonding purposes.
- EP3HTS-TC is RoHS complaint and meets NASA Low Outgassing specifications.
- It has a shelf life of 3 to 6 months.
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EP3HTS-TC properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CTE, Linear | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Die Shear Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Glass Transition Temperature (Tg) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Hardness, Shore D | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Service Temperature | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Solid Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Gravity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Lap Shear Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Thermal Conductivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Thixotropic Index | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |