Technical datasheet
3M™ Boron Nitride Cooling Filler Platelets CFP 001
Supplied by3M- Last Updated on Aug 2, 2024
3M™ Boron Nitride Cooling Filler Platelets CFP 001 by 3M is powder of highly
crystalline single platelets. It offers excellent heat spreading capabilities, excellent processability, high filler loadings and isotropic thermal conductivity. Exhibits low density, temperature stability, low loss factor and chemical resistance. It is lightweight and offers high reflectivity & electrical insulation. It provides outstanding lubricating properties and is non-abrasive to tooling. It is ideal for injection molded parts. 3M™ Boron Nitride Cooling Filler Platelets CFP 001 can be used for thermally conductive adhesives and greases for bonding. It registered in conformance with REACH according to EC directive 1907/2006.
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3M™ Boron Nitride Cooling Filler Platelets CFP 001 properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density, Bulk | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Particle Size Distribution, D90 | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Particle Size Distribution, Median | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Surface Area | 0.0 Visible After Login | Visible After Login | Visible After Login |

