3M™ Boron Nitride Cooling Filler Agglomerates CFA 250S

3M™ Boron Nitride Cooling Filler Agglomerates CFA 250SS by 3M is boron nitride platelets spray-dried with inorganic binder to spherical granulates for high flowability and dosing velocities during feeding. It offers excellent processability, high filler loadings and isotropic thermal conductivity. Provides excellent heat transfer capabilities (through-plane). Exhibits low density, temperature stability, low loss factor and chemical resistance. It is lightweight and offers high reflectivity & electrical insulation. It is best suited for conformable thermal interface materials (TIM) foils or pads. It is gentle on tooling for compounding, extrusion and injection molding processes. 3M™ Boron Nitride Cooling Filler Agglomerates CFA 250S is suitable for thermoplastic, elastomer and thermoset resins. It is used in thermally conductive adhesives and greases for bonding. It registered in conformance with REACH according to EC directive 1907/2006.