New UV-curable adhesive from Dymax addresses shadow-area bonding in medical devices
Last update on Jun 2, 2026
Formulators and process engineers working on catheter, diagnostic, and therapeutic device assembly can now evaluate a new low-viscosity adhesive grade from Dymax designed for components that incorporate opaque or light-blocking substrates.
HLC-M-1004 is part of the Dymax HLC™ Adhesives portfolio, which uses a hybrid light-curable system to enable curing in both light-exposed and shadowed areas. According to Dymax, the grade combines on-contact cure in dark areas with UV or visible-light curing at low intensity, targeting assemblies where conventional light-cure adhesives are limited by substrate opacity.
Consistent bond formation without primers
The material is supplied at low viscosity, supporting controlled dispensing and penetration into tight bond gaps. Dymax reports that bond formation is achievable without primers, which may simplify process steps in high-throughput manufacturing environments.
Additional attributes reported by the supplier include limited blooming with proper light curing, flexibility after cure, and rapid fixturing. HLC-M-1004 has been evaluated in accordance with applicable ISO 10993 biocompatibility standards and contains no nonreactive solvents. It is formulated as a one-part system.
Image Credits: Dymax