New low-viscosity HMA from Henkel targets intricate electronic components
Last update on Jun 2, 2026
Formulators working on encapsulation solutions for small-gap electronic assemblies can now evaluate Technomelt PA 6370, a new polyamide-based hot melt from Henkel designed for intricate electronic components operating in harsh environments.
According to Henkel, it is a highly flowable, ultra-low melt viscosity formulation capable of thoroughly filling gaps as small as 0.5mm. It meets rigorous industry requirements to ensure rugged moisture, heat, corrosion, and environmental resistance, elevating operational reliability.
You can review polyamide-based HMAs and compare grades directly in the Master Catalog of Adhesives.
Delivers good penetration and wetting
Henkel reports that Technomelt hot melts encapsulate electronic parts in three simple steps with minimal pressure and cycle times as low as 30 seconds. Technomelt PA 6370 has an ultra-low melt viscosity (2700 – 3000 mPa·s @ 210° C; 1065-1180 mPa·s at 240° C) that delivers good penetration and wetting along with high adhesion stability on multiple substrates, passing lap shear testing after 1,200 hours exposure to high heat and moisture (85°C/85° RH).
According to the supplier, Technomelt PA 6370 offers electrical insulation properties and meets the UL 94 V-0 flame retardancy standard. It offers a low coefficient of thermal expansion (CTE) of 175 ppm. It also offers dimensional stability and stress-resistance across its wide operating temperature range of -20° C to 140° C.
Henkel identifies Technomelt PA 6370 as well-suited for low-voltage applications such as motors, as well as connectors, sensors, printed circuit boards, and any electronic device operating in harsh, demanding conditions.
“Achieving void-free small gap filling while maintaining material adhesion strength after exposure to water, salt fog, humidity, and temperature ageing is a formidable task,” says Henkel senior business development manager, Justin Kolbe. “That’s why Technomelt PA 6370 is such an important achievement for electronics protection requirements. It delivers extreme manufacturing flexibility, high throughput, UL flame retardancy compliance, and high environmental resistance for assemblies with small gaps exposed to continuous use in harsh outdoor conditions.”
According to Kolbe, Technomelt PA 6370 dramatically expands manufacturers’ protection options. “With this innovation, many tradeoffs are eliminated,” he concludes. “You can have production speed, intricate part penetration, and excellent device fortification. Technomelt PA 6370 closes the gap.”
Image Credits: Henkel