Master Bond launches silver-filled epoxy for thermal & electrical conductivity
Last update on Apr 7, 2026
Master Bond launches Master Bond EP6STC-80, a one-component, non-frozen, silver-filled epoxy engineered for bonding, sealing and coating applications requiring exceptional thermal and electrical conductivity. This system offers an unlimited working life at room temperature and achieves full cure at a moderate temperature of 80°C.
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Compliant with NASA low-outgassing requirements
Master Bond EP6STC-80 delivers exceptional thermal conductivity of 13–14 W/(m·K) and high-level electrical conductivity, with volume resistivity measuring less than 0.001 ohm-cm. Serviceable over a temperature range of -60°C to 150°C, it bonds effectively to metals, ceramics, composites, and many plastics. This epoxy is also compliant with NASA low-outgassing requirements, making it an ideal choice for aerospace, electronic and high-reliability applications where strict contamination control is essential.
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Master Bond EP6STC-80 exhibits a high strength profile, including a tensile modulus of 1,400,000–1,800,000 psi at 25°C. The system contains no solvents or diluents and offers low shrinkage upon curing in 3-5 hours at 80°C. Featuring a thixotropic paste consistency and a viscosity of 500,000–1,500,000 cps, it is suitable for dispensing manually or with automated systems. Packaging is available in 20g, 50g, and 100g syringes, and jars in sizes up to 200g, facilitating both precision assembly and larger-scale production.
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